Magnetron Sputtering Equipment <p>Magnetron sputtering takes place inside a vacuum chamber to create a low-pressure environment. The target material, typically the material to be deposited as a thin film, is suspended inside the vacuum chamber. An inert gas, often argon, is introduced into the vacuum chamber. This gas will act as the working medium for the sputtering process. The gas atoms are ionized to form a plasma by applying a high voltage between the target (cathode) and a suspended anode. The target material is negatively charged and serves as the cathode, while the anode is positively charged. This voltage difference creates an electric field that accelerates the positively charged gas ions towards the cathode. The accelerated gas ions strike the target material with high velocity. Upon impact, the ions transfer their momentum and energy to the target atoms. This leads to the ejection of atoms from the target surface.</p> <p>The ejected atoms from the target surface move across the vacuum chamber and then condense onto the substrate, which moves under the target. This deposition process forms a thin film of the target material on the substrate.</p> <p>This process can be performed in an inert gas like argon to deposit metal films, in oxygen to deposit oxides, or in nitrogen to deposit nitrides. By using multiple cathodes with different target materials placed next to each other, it is possible to deposit complex coating stacks in one pass through the coater. Each cathode can be made of a different material, allowing for the sequential deposition of various layers to create multilayered structures or tailored material combinations.</p> Read more
PECVD Equipment <p>PECVD is achieved by introducing reactive gases between parallel electrodes. By applying a medium frequency or pulsed voltage between the electrodes, the reactive gases are excited into a plasma and chemical reaction is initiated. This low temperature process can be used to deposit silicon oxide-based layers for anti-reflective properties, as a barrier layer, or for corrosion protection. A range of coating materials is possible through a combination of process conditions and precursor selection. High dynamic deposition rates can be reached with the PECVD technology developed by AGC Plasma Technology Solutions.</p> Read more
Ion Beam Implantation Systems <p>Ion implantation equipment consists of an ion source where ions of the desired element are produced, accelerated, and subsequently bombard and penetrate the substrate surface. This surface treatment to incorporate foreign elements into a surface is well known in the semiconductor industry for doping silicon, but also in the metallurgical industry to increase hardness and corrosion resistance. AGC Plasma Technology Solutions has developed ion implantation equipment dedicated to the surface treatment of a range of materials (glass, sapphire, metals, polymers) and has been granted over 30 patents in this field. This ion implantation equipment can be used to increase surface hardness or to create anti-reflective properties.</p> Read more
Upscaling Innovative Plasma Technologies <p>AGC Plasma Technology Solutions supports inventors at universities, research institutes, and small businesses to scale up and industrialize their innovative plasma technology. By working together and leveraging our engineering expertise in industrial installations and operational excellence, we can bring your concept to industrial scale. We advise you in the design and optimization of the right equipment with the right specifications at the right cost to allow a reliable, cost-efficient and high-quality mass production.</p> Read more
